Index
1. Introduction
2. MOS Device Physics
2.2. MOS I/V Characteristics
2.3. Second-Order Effects
2.4. MOS Device Models
3. Single-Stage Amplifiers
3.3. Common-Source Stage
3.4. Source Follower
3.5. Common-Gate Stage
3.6. Cascode Stage
4. Differential Amplifiers
4.2. Basic Differential Pair
5. Current Mirrors
6. Frequency Response of Amplifiers
7. Noise
1. Introduction
This is a review on analog IC design mostly based on the book Design of Analog CMOS Integrated Circuits by Behzad Razavi, hence the index follows the same order as the chapters in the book, and most figures and text screenshots are directly from the book. Some contents are omitted for a concise review.
2. MOS Device Physics
2.2 MOS I/V Characteristics
Below is a figure showing the basic structure of a NMOS on a p-substrate.
Suppose source is grounded. As gate voltage VGS increases, holes in the p-sub are repelled from gate area to create a depletion region. When VGS reaches the threshold voltage VTH and a positive voltage is applied on VDS, electrons flow from source to the drain and form a channel. In an NMOS,
When VDS ≤ VGS – VTH, the channel spans the full length between source and drain. The MOSFET is in triode region, and the drain-to-source current ID is given by:
ID = μnCox(W/L)[(VGS – VTH)VDS – VDS2/2]
The drain-to-source resistance RDS, or Ron, is given by:
Ron = 1/[μnCox(W/L)(VGS – VTH)]
Whereas for VDS > VGS – VTH, the channel is pinched off and does not span the full length. The MOSFET enters saturation region, and ID is given by:
ID = (1/2)μnCox(W/L’)(VGS – VTH)2
Here, L’ typically remains close to L, it can be observed that ID is relatively independent of VDS.
Transconductance (usually defined in the saturation region) is defined as
gm = ∂ID/∂VGS = μnCox(W/L)(VGS – VTH) = √[2μnCox(W/L)ID] = 2ID/(VGS – VTH)